Led bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element

ABSTRACT

An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to high-power LED structures, and moreparticularly, to an insertion-type LED lamp comprising formed as asingle package operable in high-voltage environments withsignificantly-enhanced heat dissipation ability and adaptive to variousexisting lamp holders. The disclosed LED bulb structure has an insertionend, and/or a heat dissipation element, and/or a heat-and-electricityseparated element.

2. Description of Related Art

U.S. Pat. No. 6,709,132 has disclosed an LED bulb comprising a printedcircuit board which is flat when developed and is bendable to form acage, a plurality of LEDs which are disposed on the printed circuitboard, and a transparent or semi-transparent cover which encloses theprinted circuit board formed into the cage. The printed circuit boardmay have a plurality of belt-like branches which extend in radialdirections from the center of the printed circuit board. The LED bulbmay further comprise a power unit housing for containing a power unitwhich supplies electric current to each of the LEDs.

U.S. Pat. No. 6,793,374 has disclosed an LED lamp having a gear column,which is connected between a cap and substrates. The substrates arearranged as a polyhedron with planar surfaces. Each surface has at leastone LED. The gear column also has a heat-dissipater, which interconnectsthe substrates and the lamp cap.

U.S. Pat. No. 6,598,996 has disclosed a light emitting diode lamp foruse in a brake light bulb socket of an automobile. The light emittingdiode lamp has first and second printed circuit boards having first andsecond pluralities of light emitting diodes mounted thereupon foremitting monochromatic light in response to power signals supplied fromthe automobile. The light emitting diode lamp further includes a bodyadapted to form a bayonet connection, a base having at least onecontact, and a support sleeve having a wiring conduit, a support tray,and at least two support stanchions for supporting the first printedcircuit board. Finally, the light emitting diode lamp includes at leastone resistor electrically connected between the at least one contact anda first wire that is electrically connected to the first and secondprinted circuit boards.

The aforesaid prior art devices are merely adaptive to either screw lampholders or brake light bulb sockets of vehicles and are undesirablybulky. Besides, in view of the fact that there are many existing typesof lamp holders, for resource saving and environmental protection, it isdesired that an LED light is more compact, more operable in high-voltageenvironments and more adaptive to existing lamp holders.

Thus, to remedy the inconvenience and defects reflected in theirconfigurations and applications, the existing LED bulb structures needto be improved. Although all relevant manufactures have saved no effortsto solve the aforementioned problems, an applicable approach has notbeen developed. It is still a challenge for the manufacturers to providean appropriate structure to all related products with the attemptsolving the aforementioned problems. Hence, creation of a novel LED bulbstructure having an insertion end, a novel LED bulb structure having aheat dissipation element and a novel LED bulb structure having aheat-and-electricity separated element has become an immediate R&D taskand a common goal of the industry.

Considering the defects of the known LED bulb structures, the inventorof the present invention, aiming at creating a novel LED bulb structurehaving an insertion end, a novel LED bulb structure having a heatdissipation element and a novel LED bulb structure having aheat-and-electricity separated element that reform the defects of theexisting LED bulb structures and possess improved practicality, andbasing on his years of practical experience and professional knowledgein designing and manufacturing this product, has applied appropriatetheories and performing active researches and innovation. Afterunceasing researches and repeated retrofit, the inventor hereindiscloses the present invention that exactly provides practical utility.

SUMMARY OF THE INVENTION

The primary objective of the present invention is to provide an LED bulbstructure having an insertion end, an LED bulb structure having a heatdissipation element and an LED bulb structure having aheat-and-electricity separated element so as to remedy the defects ofthe conventional products by making the LED bulb structures operable inhigh-voltage environments and adaptive to various existing lamp holders,thus being more practical.

Another objective of the present invention is to provide an LED bulbstructure having an insertion end, an LED bulb structure having a heatdissipation element and an LED bulb structure having aheat-and-electricity separated element so as to remedy the defects ofthe conventional products by making the LED bulb structures havesignificantly enhanced heat dissipation efficiency. Therefore, the LEDbulb structures can normally operate in high-voltage environments, thusbeing more practical.

To achieve the objectives of the present invention, the disclosed LEDbulb structure having the insertion end comprises: a first electricallyconducting pin including a first unit and a second unit; a secondelectrically conducting pin including a third unit and a fourth unit,wherein a die pad is settled at an end of the third unit; an LED unitsettled on the die pad and having one end electrically connected to thefirst electrically conducting pin through a first leading wire and anopposite end electrically connected to the second electricallyconducting pin through a second leading wire; and a cap enclosing thefirst unit, the third unit, the die pad, the LED unit, the first leadingwire and the second leading wire, and leaving the second unit and thefourth unit exposed thereoutside. The LED bulb structure ischaracterized by that the first and second electrically conducting pinsare adapted to form bayonet connections.

To achieve the objectives of the present invention and solve thetechnical problems of the prior arts, the following means are proposedin the present invention.

In the aforesaid LED bulb structure having the insertion end, a lightextracting layer or a wavelength converting layer is further arranged onthe die pad.

In the aforesaid LED bulb structure having the insertion end, theelectrically conducting pins are bayonet pins selected from models ofG4, G5.3, G6.35, G7.9, G9, G9.5, GU4, GU5.3, GX5.3, GX6.35, GX7.9,GY5.3, GY6.35, GY7.9, GY9.5, GZ4, GZ6.36 or GZ9.5.

In the aforesaid LED bulb structure having the insertion end, the LEDunit is a high-voltage LED unit.

To achieve the objectives of the present invention, the disclosed LEDbulb structure having the heat dissipation element comprises: a firstelectrically conducting pin including a first unit and a second unit; asecond electrically conducting pin including a third unit and a fourthunit, wherein a die pad is settled at an end of the third unit; an LEDunit settled on the die pad and having one end electrically connected tothe first electrically conducting pin through a first leading wire andan opposite end electrically connected to the second electricallyconducting pin through a second leading wire; a cap enclosing the firstunit, the third unit, the die pad, the LED unit, the first leading wireand the second leading wire, and leaving the second unit and the fourthunit exposed thereoutside, and a first heat dissipation element, beingthe heat dissipation element, and such connected with the second unitand the fourth unit in a thermally conductive manner that pin portionsformed at ends of the second unit and the fourth unit, respectively, areexposed outside the first heat dissipation element.

To achieve the objectives of the present invention and solve thetechnical problems of the prior arts, the following means are proposedin the present invention.

In the aforesaid LED bulb structure having the heat dissipation element,a light extracting layer or a wavelength converting layer is furtherarranged on the die pad.

In the aforesaid LED bulb structure having the heat dissipation element,the pin portions are adapted to form bayonet connections.

In the aforesaid LED bulb structure having the heat dissipation element,the LED unit is a high-voltage LED unit.

In the aforesaid LED bulb structure having the heat dissipation element,the first heat dissipation element has a finned body.

In the aforesaid LED bulb structure having the heat dissipation element,the first heat dissipation element is made of metal or a ceramicmaterial possessing high thermal conductivity.

In the aforesaid LED bulb structure having the heat dissipation element,thermally conducting adhesive or soldering tin is applied between thefirst heat dissipation element and the second unit or the fourth unit toprovide functions of bonding and thermally conductive joining.

To achieve the objectives of the present invention, the disclosed LEDbulb structure having the heat-and-electricity separated elementcomprises: a first electrically conducting pin including a first unitand a second unit; a second electrically conducting pin including athird unit and a fourth unit; a thermally conducting pin including afifth unit and a sixth unit, wherein a die pad is settled at an end ofthe fifth unit; an LED unit settled on the die pad and having one endelectrically connected to the first electrically conducting pin througha first leading wire and an opposite end electrically connected to thesecond electrically conducting pin through a second leading wire; and acap enclosing the first unit, the third unit, the fifth unit, the diepad, the LED unit, the first leading wire and the second leading wire,and leaving the second unit, the fourth unit, and the sixth unit exposedthereoutside.

To achieve the objectives of the present invention and solve thetechnical problems of the prior arts, the following means are proposedin the present invention.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, the thermally conducting pin is shaped as a plate, apillar, a column, or a finned body.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, a light extracting layer or a wavelength convertinglayer is further arranged on the die pad.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, the pin portions are adapted to form bayonetconnections.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, the LED unit is a high-voltage LED unit.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, a second heat dissipation element, such connectedwith the sixth unit in a thermally conductive manner that pin portionsformed at ends of the second unit and the fourth unit, respectively, areexposed outside the second heat dissipation element.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, the second heat dissipation element is made of metalor a ceramic material possessing high thermal conductivity.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, the second heat dissipation element has a finnedbody.

In the aforesaid LED bulb structure having the heat-and-electricityseparated element, thermally conducting adhesive or soldering tin isapplied between the second heat dissipation element and the sixth unitto provide functions of bonding and thermally conductive joining.

As compared with the conventional devices, the present inventionprovides evident advantages and beneficial effects. Through thepreviously described configurations, the LED bulb structure having theinsertion end, the LED bulb structure having the heat dissipationelement and the LED bulb structure having the heat-and-electricityseparated element of the present invention provide at least thefollowing virtues and functions.

First, the LED bulb structure having the insertion end, LED bulbstructure having the heat dissipation element and LED bulb structurehaving the heat-and-electricity separated element disclosed herein areadaptive to the existing lamp holders.

Furthermore, the present invention improves the LED bulb structures inheat dissipation efficiency, and thus enables manufacture of high-powerand high-illumination LED bulb structures.

Besides, since the present invention improves the LED bulb structures inheat dissipation efficiency, the resultant high-power andhigh-illumination LED bulb structures are more compact and less bulky ascompared with the existing products.

To sum up, the present invention provides an LED bulb structure havingan insertion end, an LED bulb structure having a heat dissipationelement and an LED bulb structure having a heat-and-electricityseparated element. The LED bulb structure having the insertion endcomprises a first electrically conducting pin, a second electricallyconducting pin having a die pad at an end thereof, and an LED unitelectrically connected to the first electrically conducting pin and thesecond electrically conducting pin through a first leading wire and asecond leading wire, respectively, and a cap enclosing theabove-mentioned components and leaving part of the first electricallyconducting pin and the second electrically conducting pin exposedthereoutside. The LED bulb structure having the insertion end ischaracterized by that the first and second electrically conducting pinsare adapted to form bayonet connections. The LED bulb structure havingthe heat dissipation element is characterized by the heat dissipationelement attached to exposed portions of the electrically conductingpins. The LED bulb structure having the heat-and-electricity separatedelement is characterized by the thermally conducting pin. Thereby, anLED bulb structure according to the present invention can be formed as asingle package like a bulb that is convenient to replace and use whileproviding improved heat dissipation efficiency. The present inventionallows an LED bulb structure to be formed as a single package operablein high-voltage environments and applicable to various existing lampholders, thus being very practical. Besides, the present inventionsignificantly improves LED bulb structures in heat dissipationefficiency, so as to allow the LED bulb structures to normally operationin high-voltage environments and thus to be more practical. The presentinvention provides improvements and outstanding virtues, and thus ismore practical and industrially applicable. Therefore, the subjectmatter of the present invention is exactly novel, advanced andfunctional.

While the above description is merely a summary of the technicalapproach according to the present invention, for further illustratingthe technical means proposed by the present invention allowing peopleskilled in the art to use the present invention, and clarifying theabove and other objectives, features and advantages of the presentinvention, some preferred embodiments will be given below with referenceto the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic drawing of an LED bulb structure having aninsertion end according to one aspect of a first embodiment of thepresent invention.

FIG. 2 is a schematic drawing of an LED bulb structure having aninsertion end according to another aspect of the first embodiment of thepresent invention.

FIG. 3 is a schematic drawing of an LED bulb structure having a heatdissipation element according to one aspect of a second embodiment ofthe present invention, wherein a first heat dissipation element isprovided.

FIG. 4 is a schematic drawing of an LED bulb structure having a heatdissipation element according to another aspect of the second embodimentof the present invention, wherein a first heat dissipation element isprovided.

FIG. 5 is a schematic drawing of the first heat dissipation element.

FIG. 6 is a partial drawing of an LED bulb structure having aheat-and-electricity separated element according to one aspect of athird embodiment of the present invention.

FIG. 7 is a schematic drawing of an LED bulb structure having aheat-and-electricity separated element according to another aspect ofthe third embodiment of the present invention.

FIG. 8 is a schematic drawing of a second heat dissipation element.

FIG. 9A and FIGS. 9C to 9H provides tops views of different arrangementsof electrically conducting pins and thermally conducting pin accordingto the present invention.

FIG. 9B is a front view of the electrically conducting pins andthermally conducting pin of FIG. 9A.

10: LED bulb structure having insertion end

10′ : LED bulb structure having insertion end

11, 11′ : first electrically conducting pin

111: first unit

112: second unit

12, 12′ : second electrically conducting pin

121: third unit

122: fourth unit

123: reinforcing member

13: LED unit

131: first leading wire

132: second leading wire

14: cap

20: LED bulb structure having a heat dissipation element

20′ : LED bulb structure having a heat dissipation element

21: first heat dissipation element

211: first channel

212: second channel

30: LED bulb structure having a heat-and-electricity separated element

31: thermally conducting pin

311: fifth unit

312: sixth unit

32: second heat dissipation element

321: third channel

40: die pad

50: pin portions

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

To further illustrate the technical means and effects provided by thepresent invention to achieve the intended objective, the specific means,configurations, features and virtues of the LED bulb structure havingthe insertion end, LED bulb structure having the heat dissipationelement and LED bulb structure having the heat-and-electricity separatedelement proposed by the present invention will be explained belowthrough the preferred embodiments with reference to the accompanyingdrawings.

First Preferred Embodiment

Please refer to FIGS. 1 and 2 for an LED bulb structure 10 having aninsertion end according to one aspect of a first embodiment of thepresent invention and an LED bulb structure 10′ having an insertion endaccording to another aspect of the first embodiment of the presentinvention.

The LED bulb structure 10 having the insertion end comprises a firstelectrically conducting pin 11, a second electrically conducting pin 12,an LED unit 13 and a cap 14. The LED bulb structure 10 is characterizedby that the first and second electrically conducting pins 11, 12 areadapted to form bayonet connections.

The first electrically conducting pin 11 made of a material havingexcellent electrical conductivity includes a first unit 111 and a secondunit 112. The first unit 111 and a third unit 121 to be described beloware enclosed by the cap 14 while the second unit 112 and a fourth unit122 to be described below are not enclosed by the cap 14.

The second electrically conducting pin 12 made of a material havingexcellent electrical and thermal conductivity includes a third unit 121and a fourth unit 122, wherein the third unit 121 has an end formed witha die pad 40. The die pad 40 is made of the same material forming thesecond electrically conducting pin 12 and formed integrally with thesecond electrically conducting pin 12. The second electricallyconducting pin 12 may be formed similar to the first electricallyconducting pin 11 in shape, or may be formed with a plate portion.

In production of the first electrically conducting pin 11 or the secondelectrically conducting pin 12, at least one reinforcing member 123,such as a recess, at least one depressed portion, at least one raisedportion, or a structure having an irregular shape, may be formed on thefirst unit 111 or the third unit 121. Thereby, after the cap 14 isformed, combination firmness between the cap 14 and the first or secondelectrically conducting pin, 11 or 12, is further ensured.

The LED unit 13 may be an ordinary LED, or, may be particularly ahigh-voltage LED unit. The so-called high-voltage LED unit refers to anLED structure composed of a plurality of light-emitting diodes connectedin series or composed of a plurality of light-emitting diodes andimpedance elements connected in series, and adaptive to a wide range ofoperational voltages. The LED unit 13 settled on the die pad 40 has oneend electrically connected to the first electrically conducting pin 11through a first leading wire 131 and an opposite end electricallyconnected to the second electrically conducting pin 12 through a secondleading wire 132. Through the first electrically conducting pin 11 andthe second electrically conducting pin 12, power can be delivered to theLED unit 13 by way of the first leading wire 131 and the second leadingwire 132, so as to enable the LED unit 13 to emit light. Afterinstallation of the LED unit 13 and formation of wiring bonding, a lightextracting layer or a wavelength converting layer may be furtherarranged on the die pad 40 (not shown).

The cap 14 is made of a transparent material and encloses the first unit111, the third unit 121, the die pad 40, the LED unit 13, the firstleading wire 131 and the second leading wire 132 while leaving thesecond unit 112 and the fourth unit 122 exposed thereoutside. Thereby,the LED bulb structure 10 is completely formed.

To facilitate adapting LED bulb structures to the existing lamp holdersthat has been conventionally and extensively used, it is desired thatLED bulb structures are made into single packages like light bulbs, soas to be immediately coupled with the existing lamp holders. The presentembodiment is characterized by that the conducting pins of the LED bulbstructure 10 are bayonet pins compatible to the standards applied tolighting products but not the traditionally used solder pins to besoldered with a PCB. In other words, the first and second electricallyconducting pins 11, 12 have a distance therebetween and respectivedimensions (e.g. length, width, diameter, etc.) compatible to thestandards applied to lighting products while the components of the LEDbulb structure 10 other than the first and second electricallyconducting pins 11, 12 are variable according to practical needs. It isthe bayonet pins compatible to the standards applied to lightingproducts that achieve the bayonet connections and make the LED bulbstructure 10 have insertion ends.

More particularly, the bayonet pins may be any one of G4, G5.3, G6.35,G7.9, G9, G9.5, GU4, GU5.3, GX5.3, GX6.35, GX7.9, GY5.3, GY6.35, GY7.9,GY9.5, GZ4, GZ6.36 and GZ9.5, which are known models of bayonet pins inthe art.

Second Preferred Embodiment

Please refer to FIGS. 3, 4 and 5 for an LED bulb structure 20 having afirst heat dissipation element according to one aspect of a secondembodiment of the present invention, an LED bulb structure 20′ having afirst heat dissipation element 21 according to another aspect of thesecond embodiment of the present invention, and the first heatdissipation element 21.

The LED bulb structure 20 having the first heat dissipation elementcomprises a first electrically conducting pin 11, a second electricallyconducting pin 12, an LED unit 13, a cap 14, and the first heatdissipation element 21.

The first electrically conducting pin 11 made of a material havingexcellent electrical conductivity includes a first unit 111 and a secondunit 112. The first unit 111 and a third unit 121 to be described beloware enclosed by the cap 14 while the second unit 112 and a fourth unit122 to be described below are not enclosed by the cap 14.

The second electrically conducting pin 12 made of a material havingexcellent electrical and thermal conductivity includes a third unit 121and a fourth unit 122, wherein the third unit 121 has an end formed witha die pad 40. The die pad 40 is made of the same material forming thesecond electrically conducting pin 12 and formed integrally with thesecond electrically conducting pin 12. The second electricallyconducting pin 12 may be formed similar to the first electricallyconducting pin 11 in shape, or may be formed with a plate portion.

In production of the first electrically conducting pin 11 or the secondelectrically conducting pin 12, at least one reinforcing member as thatdescribed in the first embodiment may be formed on the first unit 111 orthe third unit 121. Thereby, after the cap 14 is formed, combinationfirmness between the cap 14 and the first or second electricallyconducting pin, 11 or 12, is further ensured.

The LED unit 13 may be an ordinary LED, or, may be particularly ahigh-voltage LED unit. The so-called high-voltage LED unit refers to anLED structure composed of a plurality of light-emitting diodes connectedin series or composed of a plurality of light-emitting diodes andimpedance elements connected in series, and adaptive to a wide range ofoperational voltages. The LED unit 13 settled on the die pad 40 has oneend electrically connected to the first electrically conducting pin 11through a first leading wire 131 and an opposite end electricallyconnected to the second electrically conducting pin 12 through a secondleading wire 132. Through the first electrically conducting pin 11 andthe second electrically conducting pin 12, power can be delivered to theLED unit 13 by way of the first leading wire 131 and the second leadingwire 132, so as to enable the LED unit 13 to emit light. Afterinstallation of the LED unit 13 and formation of wiring bonding, a lightextracting layer or a wavelength converting layer may be furtherarranged on the die pad 40 (not shown).

The cap 14 is made of a transparent material and encloses the first unit111, the third unit 121, the die pad 40, the LED unit 13, the firstleading wire 131 and the second leading wire 132 while leaving thesecond unit 112 and the fourth unit 122 exposed thereoutside. Thereby,the LED bulb structure 20 is completely formed.

The first heat dissipation element 21 has first channels 211 and secondchannels 212 forming openings that fittingly receive the second unit 112and the fourth unit 122 passing therethrough so that thermallyconducting combination between the first heat dissipation element 21 andthe fourth unit 122 can be effectively achieved. Besides, foreffectively diffusing heat, the first heat dissipation element 21 isdesigned as a finned body that provides enlarged heat dissipation area.

Contacting surfaces of the first heat dissipation element 21 and thefirst electrically conducting pin 11 as well as the second electricallyconducting pin 12 have to be processed by means of electric insulatingtreatment so as to prevent short circuits. Moreover, the first heatdissipation element 21 may be a single piece formed as a whole or acombination of tow or more units. In addition, the first heatdissipation element 21 is particularly made of metal, such as copper oraluminum alloy, or ceramic materials possessing high thermalconductivity, such as aluminum nitride or boron nitride.

For not hindering assembly between the LED bulb structure 20 and a lampholder, the first heat dissipation element 21 is such arranged that pinportions 50 formed at ends of the second unit 112 and the fourth unit122 are left exposed thereoutside. The pin portions 50 of the LED bulbstructure 20 having the first heat dissipation element 21 may act assolder pins to be soldered with a PCB. Alternatively, the pin portions50 may be bayonet pins as described in the first preferred embodiment,so that the LED bulb structure 20 can be immediately coupled with a lampholder. Besides, a thermally conducting adhesive or soldering tin may beapplied between the first heat dissipation element 21 and the secondunit 112 or the fourth unit 122 to provide functions of bonding andthermally conductive joining.

Third Preferred Embodiment

Please refer to FIGS. 6, 7, and 8 for an LED bulb structure 30 having aheat-and-electricity separated element according to one aspect of athird embodiment of the present invention, an LED bulb structure 30having a heat-and-electricity separated element according to anotheraspect of the third embodiment of the present invention, and a secondheat dissipation element 32.

The LED bulb structure 30 having a heat-and-electricity separatedelement comprises a first electrically conducting pin 11, a secondelectrically conducting pin 12, a thermally conducting pin 31, an LEDunit 13 and a cap 14.

The first electrically conducting pin 11 made of a material havingexcellent electrical conductivity includes a first unit 111 and a secondunit 112. The first unit 111 and a third unit 121 as well as a fifthunit 311 to be described below are enclosed by the cap 14 while thesecond unit 112 and a fourth unit 122 as well as a sixth unit 312 to bedescribed below are not enclosed by the cap 14.

The second electrically conducting pin 12 made of a material havingexcellent electrical and thermal conductivity includes a third unit 121and a fourth unit 122. In production of the first electricallyconducting pin 11 or the second electrically conducting pin 12, at leastone reinforcing member as that described in the first embodiment may beformed on the first unit 111, the third unit 121, or the fifth unit 311to be described below. Thereby, after the cap 14 is formed, combinationfirmness between the cap 14 and the first or second electricallyconducting pin, 11 or 12, is further ensured.

The thermally conducting pin 31 includes the fifth unit 311 and thesixth unit 312, wherein a die pad 40 is formed at an end of the fifthunit 311. The die pad 40 is made of the same material forming thethermally conducting pin 31 and formed integrally with the thermallyconducting pin 31. Generally, the thermally conducting pin 31 may be aplate, a pillar, a column, a finned body, and so on as long as heatgenerated at the die pad 40 can be effectively conducted outward.

The LED unit 13 may be an ordinary LED, or, may be particularly ahigh-voltage LED unit. The so-called high-voltage LED unit refers to anLED structure composed of a plurality of light-emitting diodes connectedin series or composed of a plurality of light-emitting diodes andimpedance elements connected in series, and adaptive to a wide range ofoperational voltages. The LED unit 13 settled on the die pad 40 has oneend electrically connected to the first electrically conducting pin 11through a first leading wire 131 and an opposite end electricallyconnected to the second electrically conducting pin 12 through a secondleading wire 132. Through the first electrically conducting pin 11 andthe second electrically conducting pin 12, power can be delivered to theLED unit 13 by way of the first leading wire 131 and the second leadingwire 132, so as to enable the LED unit 13 to emit light. Afterinstallation of the LED unit 13 and formation of wiring bonding, a lightextracting layer or a wavelength converting layer may be furtherarranged on the die pad 40 (not shown).

The cap 14 is made of a transparent material and encloses the first unit111, the third unit 121, the fifth unit 311, the die pad 40, the LEDunit 13, the first leading wire 131 and the second leading wire 132while leaving the second unit 112, the fourth unit 122, and the sixthunit 312 exposed thereoutside. Thereby, the LED bulb structure 30 iscompletely formed.

For further enhancing thermal conductivity, the thermally conducting pin31 may have the second heat dissipation element 32 attached thereto. Thesecond heat dissipation element 32 has therein a third channel 321 forfittingly receiving the sixth unit 312 passing therethrough so thatthermally conducting combination between the second heat dissipationelement 32 and the sixth unit 312 can be effectively achieved. Inaddition, the second heat dissipation element 32 has therein a firstchannel 211 and a second channel 212 for fittingly receiving the secondunit 112 and the fourth unit 122 passing therethrough so that the secondheat dissipation element 32 can get coupled with the LED bulb structure30.

Contacting surfaces between the second heat dissipation element 32 andthe first electrically conducting pin 11 as well as the secondelectrically conducting pin 12 or contacting surfaces between the secondheat dissipation element 32 and the first electrically conducting pin11, the second electrically conducting pin 12, as well as the thermallyconducting pin 31 have to be processed by means of electric insulatingtreatment so as to prevent short circuits. Moreover, the second heatdissipation element 32 may be a single piece formed as a whole or acombination of tow or more units. In addition, the second heatdissipation element 32 is particularly made of metal, such as copper oraluminum alloy, or ceramic materials possessing high thermalconductivity, such as aluminum nitride or boron nitride.

Besides, for effectively diffusing heat, the second heat dissipationelement 32 is designed as a finned body that provides enlarged heatdissipation area. For not hindering assembly between the LED bulbstructure 30 and a lamp holder, the second heat dissipation element 32is such arranged that pin portions 50 formed at ends of the second unit112 and the fourth unit 122 are left exposed thereoutside. The pinportions 50 of the LED bulb structure 30 having the heat-and-electricityseparated element may act as solder pins to be soldered with a PCB.Alternatively, the pin portions 50 may be bayonet pins as described inthe first embodiment, so that the LED bulb structure 30 can beimmediately coupled with a lamp holder. Besides, a thermally conductingadhesive or soldering tin may be applied between the second heatdissipation element 32 and the thermally conducting pin 31 to providefunctions of bonding and thermally conductive joining.

Please refer to FIGS. 9A through 9H for different arrangements ofelectrically conducting pins and thermally conducting pin 31 in the LEDbulb structure 30 having the heat-and-electricity separated elementaccording to the present invention. Therein, FIG. 9B is a front view ofthe structure of FIG. 9A. For catering for all levels of heatdissipation, the LED bulb structure 30 having the heat-and-electricityseparated element may have the thermally conducting pin 31 arrangeddifferently as shown in FIGS. 9A to 9H. According to the top views inFIG. 9A and FIGS. 9C to 9H, the first electrically conducting pin 11,the second electrically conducting pin 12, and the thermally conductingpin 31 may have portions thereof that are enclosed by the cap 14 or thesecond heat dissipation element 32 configured into various arrangementsso as to allow the LED bulb structure 30 having the heat-and-electricityseparated element to have improved design flexibility in the firstelectrically conducting pin 11, the second electrically conducting pin12, and the thermally conducting pin 31. However, when the LED bulbstructure 30 having the heat-and-electricity separated element hasinsertion ends, to ensure the portions of the second unit 112 and thefourth unit 122 of the first electrically conducting pin 11 and thesecond electrically conducting pin 12 that are not enclosed by the cap14 or the pin portions 50 that are not enclosed by the second heatdissipation element 32 are compatible to the standards applied tolighting products, the first electrically conducting pin 11 and thesecond electrically conducting pin 12 must have their lower portionrecessed, as shown in FIG. 9B. On the other hand, for being compatibleto the standards applied to lighting products of the insertion ends,positional exchange between the thermally conducting pin 31 having largearea or volume and the first electrically conducting pin 11 as well asthe second electrically conducting pin 12 may be necessary so that thesecond unit 112 and the fourth unit 122 of the first electricallyconducting pin 11 and the second electrically conducting pin 12 or thepin portions 50 can be coupled with the socket of a conventional lampholder.

The present invention has been described with reference to the preferredembodiment and it is understood that the embodiments are not intended tolimit the scope of the present invention. Moreover, as the contentsdisclosed herein should be readily understood and can be implemented bya person skilled in the art, all equivalent changes or modificationswhich do not depart from the concept of the present invention should beencompassed by the appended claims.

INDUSTRIAL APLICABILITY

As compared with the conventional devices, the present inventionprovides evident advantages and beneficial effects. Through thepreviously described configurations, the LED bulb structure, LED bulbstructure having the heat dissipation element and LED bulb structurehaving the heat-and-electricity separated element of the presentinvention provide at least the following virtues and functions.

First, the present invention provides the LED bulb structure having thefirst and second electrically conducting pins adapted to form bayonetconnections, the disclosed LED bulb structure having the heatdissipation element attached to the exposed portions of the electricallyconducting pins, and the LED bulb structure having theheat-and-electricity separated element further having the thermallyconducting pin. Thereby, the LED bulb structures of the presentinvention are singled packages formed as light bulbs that are convenientto replace and use while providing improved heat dissipation efficiency.

Secondly, the LED bulb structure having the insertion end, LED bulbstructure having the heat dissipation element and LED bulb structurehaving the heat-and-electricity separated element disclosed herein areadaptive to the existing lamp holders.

Furthermore, the present invention improves the LED bulb structures inheat dissipation efficiency, and thus enables manufacture of high-powerand high-illumination LED bulb structures.

Besides, since the present invention improves the LED bulb structures inheat dissipation efficiency, the resultant high-power andhigh-illumination LED bulb structures are more compact and less bulky ascompared with the existing products.

To sum up, the present invention provides LED bulb structures that areformed as single packages for being immediately applicable to existinglamp holder and significantly and have excellent heat dissipationefficiency so as to be operable in high-voltage environments, therebyensuring practicability and industrial applicability of the presentinvention.

1. An LED bulb structure having an insertion end, comprising: a first electrically conducting pin including a first unit and a second unit; a second electrically conducting pin including a third unit and a fourth unit, wherein a die pad is settled at an end of the third unit; an LED unit settled on the die pad while having one end electrically connected to the first electrically conducting pin through a first leading wire and an opposite end electrically connected to the second electrically conducting pin through a second leading wire; and a cap enclosing the first unit, the third unit, the die pad, the LED unit, the first leading wire and the second leading wire, while leaving the second unit and the fourth unit exposed thereoutside; the LED bulb structure being characterized by that: the first and second electrically conducting pins are adapted to form bayonet connections.
 2. The LED bulb structure having the insertion end of claim 1, wherein a light extracting layer or a wavelength converting layer is further arranged on the die pad.
 3. The LED bulb structure having the insertion end of claim 1, wherein each of the electrically conducting pins is a bayonet pin of a model of G4, G5.3, G6.35, G7.9, G9, G9.5, GU4, GU5.3, GX5.3, GX6.35, GX7.9, GY5.3, GY6.35, GY7.9, GY9.5, GZ4, GZ6.36 or GZ9.5.
 4. The LED bulb structure having the insertion end of claim 1, wherein the LED unit is a high-voltage LED unit.
 5. An LED bulb structure having a heat dissipation element, comprising: a first electrically conducting pin including a first unit and a second unit; a second electrically conducting pin including a third unit and a fourth unit, wherein a die pad is settled at an end of the third unit; an LED unit settled on the die pad while having one end electrically connected to the first electrically conducting pin through a first leading wire and an opposite end electrically connected to the second electrically conducting pin through a second leading wire; a cap enclosing the first unit, the third unit, the die pad, the LED unit, the first leading wire and the second leading wire, while leaving the second unit and the fourth unit exposed thereoutside; and a first heat dissipation element, being the heat dissipation element, and such connected with the second unit and the fourth unit in a thermally conductive manner that pin portions formed at ends of the second unit and the fourth unit, respectively, are exposed outside the first heat dissipation element.
 6. The LED bulb structure having the heat dissipation element of claim 5, wherein a light extracting layer or a wavelength converting layer is further arranged on the die pad.
 7. The LED bulb structure having the heat dissipation element of claim 5, wherein the pin portions are adapted to form bayonet connections.
 8. The LED bulb structure having the heat dissipation element of claim 5, wherein the LED unit is a high-voltage LED unit.
 9. The LED bulb structure having the heat dissipation element of claim 5, wherein the first heat dissipation element has a finned body.
 10. The LED bulb structure having the heat dissipation element of claim 5, wherein the first heat dissipation element is made of metal or a ceramic material possessing high thermal conductivity.
 11. The LED bulb structure having the heat dissipation element of claim 5, wherein thermally conducting adhesive or soldering material is applied between the first heat dissipation element and the second unit or the fourth unit to provide functions of bonding and thermally conductive joining.
 12. An LED bulb structure having a heat-and-electricity separated element, comprising: a first electrically conducting pin including a first unit and a second unit; a second electrically conducting pin including a third unit and a fourth unit; a thermally conducting pin including a fifth unit and a sixth unit, wherein a die pad is settled at an end of the fifth unit; an LED unit settled on the die pad while having one end electrically connected to the first electrically conducting pin through a first leading wire and an opposite end electrically connected to the second electrically conducting pin through a second leading wire; and a cap enclosing the first unit, the third unit, the fifth unit, the die pad, the LED unit, the first leading wire and the second leading wire while leaving the second unit, the fourth unit, and the sixth unit exposed thereoutside.
 13. The LED bulb structure having the heat-and-electricity separated element of claim 12, wherein the thermally conducting pin is shaped as a plate, a pillar, a column, or a finned body.
 14. The LED bulb structure having the heat-and-electricity separated element of claim 12, wherein a light extracting layer or a wavelength converting layer is further arranged on the die pad.
 15. The LED bulb structure having the heat-and-electricity separated element of claim 12, wherein the pin portions are adapted to form bayonet connections.
 16. The LED bulb structure having the heat-and-electricity separated element of claim 12, wherein the LED unit is a high-voltage LED unit.
 17. The LED bulb structure having the heat-and-electricity separated element of claim 12, further comprising a second heat dissipation element, such connected with the sixth unit in a thermally conductive manner that pin portions formed at ends of the second unit and the fourth unit, respectively, are exposed outside the second heat dissipation element.
 18. The LED bulb structure having the heat-and-electricity separated element of claim 17, wherein the second heat dissipation element is made of metal or a ceramic material possessing high thermal conductivity.
 19. The LED bulb structure having the heat-and-electricity separated element of claim 17, wherein the second heat dissipation element has a finned body.
 20. The LED bulb structure having the heat-and-electricity separated element of claim 17, wherein thermally conducting adhesive or soldering material is applied between the second heat dissipation element and the sixth unit to provide functions of bonding and thermally conductive joining. 